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Home » Product List » FCCL » Pi Copper Clad Laminate
Product Details
Pi Copper Clad Laminate
| Productivity: | 250, 000 Sqm/Year |
|---|---|
| Unit Price: | Negotiable |
| Shipment Terms: | CIF |
| Payment Terms: | L/C,T/T,D/P |
| Price Valid Time: | From Feb 24,2012 To Feb 24,2013 |
| Origin: | China |
| Export Markets: | North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe |
This series includes various types according to different copper and PI film utilized to meet the specific needs of customers. See usual specifications as follows:
Base PI film: 0.5 ~ 2.0mils thickness;
Copper foil: EDHD & RA copper both available, 1/3, 1/2, 1.0 & 2.0 Oz thicknesses;
Adhesive: Modified epoxy adhesive, 0.5 ~ 0.7 mils;
Laminate structure: Single side & Double sides both available;
Features & Applications:
--Meet the RoHS requirement & halogen free, and pass SGS certificate.
--Higher bond strength, good dielectric properties
--Excellent chemical and solvent resistance, good solder heating resistance.
--Excellent dimensional stability.
Widely used in the data communication, aerospace, personal computer and automotive fields.
Our best quotation and details catalog will be sent to you upon your special requests. Good welcome to touch us by Email or Phone
