Aluminum Copper Clad Sheet for PCB Manufacturer

• Structure: Metal Base Rigid PCB
• Dielectric: Al
• Material: Al
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: AL CCL
• Application: PCB
• Flame Retardant Properties: V1
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Aluminum
• Insulation Materials: Epoxy Resin
• Brand: Hfi
• Transport Package: Pallet
• Specification: 1000*1200
• Trademark: no
• Origin: China
• Package Size: 120.00cm * 250.00cm * 60.00cm
• Package Gross Weight: 1000.000kg

Product Description

AL COPPER CLAD SHEET

Item	Test  Method	Unit	FW806	FW808	FW810	FW815	FW820
			0.6W	0.8W	1.0W	1.5W	2.0W
Dielectric layer thickness	After slicing, measure under microscope	μm	110-130	110-130	110-130	110-130	110-130
Thermal stress	288ºC±5ºC(180s) ,	SEC	≥120	≥120	≥120	≥120	≥120
Peel Strength	IPC-TM-650-2.4.8.1	N/mm	>1.0	>1.0	>1.0	>1.0	>1.0
Leakage  voltage	50mm,current≤5mA	KV	AC≥3	AC≥3	AC≥3	AC≥3	AC≥3
	50mm, current≤0.5mA	KV	DC≥4	DC≥4	DC≥5	DC≥5	DC≥5
Breakdown Voltage	IPC-TM-650-2.5.6	KV	AC≥5	AC≥5	AC≥5	AC≥5	AC≥5
TG(DSC)	IPC-TM-650-2.4.25	ºC	>130	>130	>130	>130	>130
(TMA)	IPC-TM-650-2.4.24	%(50~260ºC)	0.5	0.5	0.5	0.5	0.5
Thermal Conductivity	Thermal conductivity tester	W/(M.K)	>0.6	>0.8	>1.0	>1.3	>1.7
Thermal Resistance	Thermal conductivity tester	ºC/W	<0.8	<0.7	<0.55	<0.5	<0.4
Copper Foil	After slicing, measure under microscope	μm	15±2,18±2,22±2,25±2, 33±3,35±3,70±6
Product thickness	External Micrometer	mm	(thickness)0.6-2.0                      (Tolerance):≥-0.12
Aluminum Substrate	/	/	(Aluminum grade): 1060/5052
Features
1.(CCL),
Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of
electronic products.
2.;Superior machnical properties
3.Applications:LED, LED based lightings,backlights,etc.