High Thermal Conductivity Aluminum Ccl / Copper Clad Laminate

• Application: Electrical Base, Shell
• Type: PCB Base
• Chemistry: Hybrid Insulation
• Material: Aluminum+Copper Foil
• Thermal Rating: B 130
• Maximum Voltage: <10KV
• Model NO.: Al CCL
• Classification: Hybrid Insulation Materials
• Color: Green + Blue
• Sheet Thickness: 0.8~2.0mm
• Copper Foil Thickness: 25μm, 18μm, 35μm, 70μm
• Thermal Conductivity: 0.8W/M.K, 1.0W/M.K, 1.5W/M.K, 1.8W/M.K, 2.0W/M.K,
• Transport Package: Pallet
• Specification: IPC4101, UL
• Origin: China
• HS Code: 74102110
• Production Capacity: 100, 000 PCS/Year

Product Description

Al Copper Clad Laminates

This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.

--excellent heating radiating
--good electric magnetic shield
--good electrical and machinery cutting

Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.

AL: 1060, 5052, 6061
Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm. 1.5mm, 1.6mm. 2.0mm. 3.0mm

Copper thickness: Hoz, 1oz, 2oz, 25μm

Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm
Thermal conductivity: 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 1.8W/m.K, 2.0W/m.K, 3.00W/m.K
Protective film: blue film (80ºC), green film (160ºC)

Our best quotation and details catalog will be sent to you upon your special requests. Good welcome to touch us by Email or Phone.
 

Technical Data
Item	Test  Method	Unit	Technical Value
			FW806	FW808	FW810	FW815	FW820
			0.6W	0.8W	1.0W	1.5W	2.0W
Dielectric layer thickness	After slicing, measure under microscope	μm	110-130	110-130	110-130	110-130	110-130
Thermal stress	288ºC±5ºC(180s)	SEC	≥120	≥120	≥120	≥120	≥120
Peel Strength	IPC-TM-650-2.4.8.1	N/mm	>1.0	>1.0	>1.0	>1.0	>1.0
Leakage  voltage	circle copper dia.50mm current≤5mA	KV	AC≥3	AC≥3	AC≥3	AC≥3	AC≥3
	circle copper dia.50mm current≤0.5mA	KV	DC≥4	DC≥4	DC≥5	DC≥5	DC≥5
Breakdown Voltage	IPC-TM-650-2.5.6	KV	AC≥5	AC≥5	AC≥5	AC≥5	AC≥5
TG(DSC)	IPC-TM-650-2.4.25	ºC	>130	>130	>130	>130	>130
TMA	IPC-TM-650-2.4.24	%(50~260ºC)	0.5	0.5	0.5	0.5	0.5
Thermal Conductivity	Thermal conductivity tester	W/(M.K)	>0.6	>0.8	>1.0	>1.3	>1.7
Thermal Resistance	Thermal conductivity tester	ºC/W	<0.8	<0.7	<0.55	<0.5	<0.4
Copper Foil	After slicing, measure under microscope	μm	15±2,18±2,22±2,25±2, 33±3,35±3,70±6
Product thickness	External Micrometer	mm	thickness0.6-2.0                      Tolerance:≥-0.12
Aluminum Substrate	/	/	Aluminum grade:1060/5052
Features
1.Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of
electronic products.
2.Superior machnical properties
3.Applications: LED based lightings,backlights,etc.

Process