AL COPPER CLAD SHEET
Product Description
Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of electronic products.
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Item |
Test Method |
Unit |
FW806 |
FW808 |
FW810 |
FW815 |
FW820 |
0.6W |
0.8W |
1.0W |
1.5W |
2.0W |
Dielectric layer thickness |
After slicing, measure under microscope |
μm |
110-130 |
110-130 |
110-130 |
110-130 |
110-130 |
Thermal stress |
288ºC±5ºC(180s) , |
SEC |
≥120 |
≥120 |
≥120 |
≥120 |
≥120 |
Peel Strength |
IPC-TM-650-2.4.8.1 |
N/mm |
>1.0 |
>1.0 |
>1.0 |
>1.0 |
>1.0 |
Leakage voltage |
50mm,current≤5mA |
KV |
AC≥3 |
AC≥3 |
AC≥3 |
AC≥3 |
AC≥3 |
50mm, current≤0.5mA |
KV |
DC≥4 |
DC≥4 |
DC≥5 |
DC≥5 |
DC≥5 |
Breakdown Voltage |
IPC-TM-650-2.5.6 |
KV |
AC≥5 |
AC≥5 |
AC≥5 |
AC≥5 |
AC≥5 |
TG(DSC) |
IPC-TM-650-2.4.25 |
ºC |
>130 |
>130 |
>130 |
>130 |
>130 |
(TMA) |
IPC-TM-650-2.4.24 |
%(50~260ºC) |
0.5 |
0.5 |
0.5 |
0.5 |
0.5 |
Thermal Conductivity |
Thermal conductivity tester |
W/(M.K) |
>0.6 |
>0.8 |
>1.0 |
>1.3 |
>1.7 |
Thermal Resistance |
Thermal conductivity tester |
ºC/W |
<0.8 |
<0.7 |
<0.55 |
<0.5 |
<0.4 |
Copper Foil |
After slicing, measure under microscope |
μm |
15±2,18±2,22±2,25±2,
33±3,35±3,70±6 |
Product thickness |
External Micrometer |
mm |
(thickness)0.6-2.0 (Tolerance):≥-0.12 |
Aluminum Substrate |
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(Aluminum grade): 1060/5052 |
Features |
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1.(CCL), |
Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of electronic products. |
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2.;Superior machnical properties |
3.Applications:LED, LED based lightings,backlights,etc. |