Xpc High Quality Copper Clad Sheet

• Customization: Available
• Structure: Metal Base Rigid PCB
• Dielectric: Al
• Model NO.: xpc
• Application: PCB
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Aluminum
• Insulation Materials: Epoxy Resin
• Brand: Hfi
• Size: 1020*2040
• Transport Package: Pallet
• Specification: 1000*1200
• Trademark: no
• Origin: China

Product Description

AL COPPER CLAD SHEET

Product Description

Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of    electronic products.

 

Item	Test  Method	Unit	FW806	FW808	FW810	FW815	FW820
			0.6W	0.8W	1.0W	1.5W	2.0W
Dielectric layer thickness	After slicing, measure under microscope	μm	110-130	110-130	110-130	110-130	110-130
Thermal stress	288ºC±5ºC(180s) ,	SEC	≥120	≥120	≥120	≥120	≥120
Peel Strength	IPC-TM-650-2.4.8.1	N/mm	>1.0	>1.0	>1.0	>1.0	>1.0
Leakage  voltage	50mm,current≤5mA	KV	AC≥3	AC≥3	AC≥3	AC≥3	AC≥3
	50mm, current≤0.5mA	KV	DC≥4	DC≥4	DC≥5	DC≥5	DC≥5
Breakdown Voltage	IPC-TM-650-2.5.6	KV	AC≥5	AC≥5	AC≥5	AC≥5	AC≥5
TG(DSC)	IPC-TM-650-2.4.25	ºC	>130	>130	>130	>130	>130
(TMA)	IPC-TM-650-2.4.24	%(50~260ºC)	0.5	0.5	0.5	0.5	0.5
Thermal Conductivity	Thermal conductivity tester	W/(M.K)	>0.6	>0.8	>1.0	>1.3	>1.7
Thermal Resistance	Thermal conductivity tester	ºC/W	<0.8	<0.7	<0.55	<0.5	<0.4
Copper Foil	After slicing, measure under microscope	μm	15±2,18±2,22±2,25±2, 33±3,35±3,70±6
Product thickness	External Micrometer	mm	(thickness)0.6-2.0                      (Tolerance):≥-0.12
Aluminum Substrate	/	/	(Aluminum grade): 1060/5052
Features
1.(CCL),
Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of electronic products.
2.;Superior machnical properties
3.Applications:LED, LED based lightings,backlights,etc.