White Coated Pi Coverlay Film

• Application: Insulators
• Type: Insulation Film
• Chemistry: Heat Resistance
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: pi coverlay film
• Material: Polyimide Film
• Thermal Rating: 250 250
• Maximum Voltage: 20KV~100KV
• Classification: Inorganic Insulation Material
• Certification: ISO9001
• Color: Yellow
• Brand: Hfi
• Transport Package: Pallet
• Specification: CUSTOMIZED
• Trademark: NO
• Origin: China
• Production Capacity: 100000

Product Description

 

PI Film with White Coating for FPCB as Coverlay FCWPIH45A25/PA-500
 

1. Product type:FCWPIH45A25/PA Polyimide film coverlay (white)

FC WPIH45 A25/ PA- 500
Width 500mm,more width can be provided.
PA means release paper.
A means adhesive, thickness 25 um
White coating thickness 20um + domestic PI film thickness 25um.
FC product classification for coverlay
 

1. FCWPIH45A25/PA Polyimide film coverlay (white)(TDS):

Test Item	Technical parameter required	Test method
Appearance *	Surface is flat and smooth, non-wrinkle and defect,No colour change under temperature	By visual
Tolerance for white coating.*	19~21um	Corporation QC
Tolerance for adh. *	24~26um(A906)	Corporation QC
Dimensional stability*: Paper removed Paper removed+Heat treatment	(TD/MD): ±0.10 % ±0.15%	(TD/MD): ±0.15 % ±0.15%
Peel strength *: 1:as received(≥) 2:dip soldering(≥)	unit:Kgf/cm 0.9 0.9	IPC-TM-650-2.4.9 Method B &C
Dip weldability *	300ºC,30s	IPC-TM-650-2.4.13
Adhesive fluidity*	0.06~0.12mm	IPC-TM-650-2.3.17
Adhesive flammability	V-0	UL 94V-0
Chemical resistance	≥90%	IPC-TM-650-2.3.2
hygroscopicity	≤4.0%	IPC-TM-650-2.6.2
Adhesive temperature	95~115ºC	Melting point bar test
Dielectric constant(1 MHz)	≤3.6	IPC-TM-650-2.5.5.3
Dielectric loss factor(1 MHz)	0.04	IPC-TM-650-2.5.5.3
Dielectric strength	800 KV/cm	ASTM-D-149
Tensile strength	120 MPa	ASTM-D-882

The above data are typical values for typical products Note *: Testing reports will be attached with every product delivery.

 

1. Recommendatory process condition for press:

 

Press method	Press temp.	Pressure	Time for press	Temp.for de-pressure
laminating	160ºC~175ºC	15~20 kgf/cm2	45~60 mins	Under 60ºC
Fast press	170ºC~185ºC	20~30 kgf/cm2	2~3 mins	Need Post-processing

1. When fast press, need post-processing, suggested condition:145~155ºC for 1 hour
2. Choose proper press method according user's own technical parameter, ensure the coverlay film is well bonded to the covered substrate and meet the expected FPCB's quality demand.